Product Material Contents

Pyramid Semiconductor manufactures:

Standard Products
The composition in standard products is approximately:
Ceramic products solder dip composition:
~ 63% Tin (Sn)
~ 37% Lead (Pb)
Plastic products tin/lead finish composition:
~ 85% Tin (Sn)
~ 15% Lead (Pb)
Environmentally Preferred Products (EPP) in compliance with Restriction of Hazardous Substances (RoHS) Directive
Environmentally Preferred Products are RoHS-6 compliant, and have less than the following limits for these restricted substances:
Substance Actual Allowed
Cadmium (Cd) ≤ 2.0 ppm  < 0.01%
Mercury (Hg) ≤ 5.0 ppm 0.1%
Hexavalent Chromium (Hex-Cr) ≤ 2.0 ppm < 0.1%
Polybrominated Biphenyls (PBB) ≤ 5.0 ppm 0.1%
Polybrominated Diphenyl Ethers (PBDE) ≤ 5.0 ppm 0.1%
Lead (Pb) ≤ 5.0 ppm 0.1%

RoHS-6 devices are available only in plastic.  The composition of the leads on these devices is Matte Tin (Sn) 100%.  Plastic devices are available in RoHS-5 and RoHS-6 versions.

Lead free devices are not available in ceramic.

RoHS-6 Compliant Devices have an "LF" suffix added to the standard part number.

e.g.
P4C1256-25JC for Standard RoHS-5 Product
P4C1256-25JCLF for Lead-free RoHS-6 Product

 
StandardEnvironmentally Preferred Products
CompoundCeramicPlasticCeramicPlastic
PbLead37%15%N/A≤ 5.0 ppm actual vs. 0.1% allowed
SnTin63%85%Composition is 100% Matte Tin
CdCadmium  ≤ 2.0 ppm actual vs. < 0.01% allowed
HgMercury  ≤ 5.0 ppm actual vs. 0.1% allowed
Hex-CrHexavalent Chromium  ≤ 2.0 ppm actual vs. < 0.1% allowed
PBBPolybrominated Biphenyls  ≤ 5.0 ppm actual vs. 0.1% allowed
PBDEPolybrominated Diphenyl Ethers  ≤ 5.0 ppm actual vs. 0.1% allowed