Pyramid Semiconductor understands compliance to Environment, Health & Safety regulations and implements it in every relevant area of the manufacturing process.
We provide solutions compliant to RoHS Directive 2011/65/EU, 2015/863 and REACH Regulation EC 1907/2006 and EU 2022/477 in our Lead Free semiconductor product offerings, which have an "LF" suffix at the end of the standard part number.
View our RoHS/REACH Statement
Our Standard Products are offered in a variety of different plastic and hermetic ceramic packages with the following solder dip material composition:
- ~ 63% Tin (Sn)
- ~ 37% Lead (Pb)
For our Lead Free products in compliance with Restriction of Hazardous Substances (RoHS) Directive and Registration, Evaluation, Authorization and Restriction of Chemicals (REACH):
Lead Free products are RoHS-10/REACH compliant, and have less than the following limits for these restricted substances:
|Cadmium (Cd)||< 0.01%|
|Mercury (Hg)||< 0.1%|
|Hexavalent Chromium (Hex-Cr)||< 0.1%|
|Polybrominated Biphenyls (PBB)||< 0.1%|
|Polybrominated Diphenyl Ethers (PBDE)||< 0.1%|
|Lead (Pb)||< 0.1%|
|Bis(2-Ethylhexyl) phthalate (DEHP)||< 0.1%|
|Benzyl butyl phthalate (BBP)||< 0.1%|
|Dibutyl phthalate (DBP)||< 0.1%|
|Diisobutyl phthalate (DIBP)||< 0.1%|
RoHS-10/REACH compliant devices are available in plastic packages. The composition of the leads on these devices is Matte Tin (Sn) 100%.
Some standard products can be supplied RoHS-10 compliant as special products, contact factory for more information.