Pyramid Semiconductor understands compliance to Environment, Health & Safety regulations and implements it in every relevant area of the manufacturing process.

We provide solutions compliant to RoHS Directive 2011/65/EU, 2015/863 and REACH Regulation EC 1907/2006 and EU 2022/477 in our Lead Free semiconductor product offerings, which have an "LF" suffix at the end of the standard part number.

View our RoHS/REACH Statement

Our Standard Products are offered in a variety of different plastic and hermetic ceramic packages with the following solder dip material composition:

  • ~ 63% Tin (Sn)
  • ~ 37% Lead (Pb)

For our Lead Free products in compliance with Restriction of Hazardous Substances (RoHS) Directive and Registration, Evaluation, Authorization and Restriction of Chemicals (REACH):

Lead Free products are RoHS-10/REACH compliant, and have less than the following limits for these restricted substances:

Substance Allowed
Cadmium (Cd) < 0.01%
Mercury (Hg) < 0.1%
Hexavalent Chromium (Hex-Cr) < 0.1%
Polybrominated Biphenyls (PBB) < 0.1%
Polybrominated Diphenyl Ethers (PBDE) < 0.1%
Lead (Pb) < 0.1%
Bis(2-Ethylhexyl) phthalate (DEHP) < 0.1%
Benzyl butyl phthalate (BBP) < 0.1%
Dibutyl phthalate (DBP) < 0.1%
Diisobutyl phthalate (DIBP) < 0.1%

RoHS-10/REACH compliant devices are available in plastic packages. The composition of the leads on these devices is Matte Tin (Sn) 100%.

Some standard products can be supplied RoHS-10 compliant as special products, contact factory for more information.